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This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References
| Autorius: | Manos M. Tentzeris, Jong-Hoon Lee, |
| Serija: | Synthesis Lectures on Computational Electromagnetics |
| Leidėjas: | Springer International Publishing |
| Išleidimo metai: | 2007 |
| Knygos puslapių skaičius: | 120 |
| ISBN-10: | 3031005759 |
| ISBN-13: | 9783031005756 |
| Formatas: | 235 x 191 x 7 mm. Knyga minkštu viršeliu |
| Kalba: | Anglų |
Parašykite atsiliepimą apie „Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging“
