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This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
| Autorius: | Krishnendu Chakrabarty, Ran Wang, |
| Leidėjas: | Springer Nature Switzerland |
| Išleidimo metai: | 2017 |
| Knygos puslapių skaičius: | 196 |
| ISBN-10: | 3319547135 |
| ISBN-13: | 9783319547138 |
| Formatas: | 241 x 160 x 17 mm. Knyga kietu viršeliu |
| Kalba: | Anglų |
Parašykite atsiliepimą apie „Testing of Interposer-Based 2.5D Integrated Circuits“
