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High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
| Autorius: | Luc Martens |
| Serija: | Electronic Packaging and Interconnects |
| Leidėjas: | Springer US |
| Išleidimo metai: | 1998 |
| Knygos puslapių skaičius: | 174 |
| ISBN-10: | 0792383079 |
| ISBN-13: | 9780792383079 |
| Formatas: | 241 x 160 x 15 mm. Knyga kietu viršeliu |
| Kalba: | Anglų |
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