Grain Structures & Effects of Stress on Grain Boundaries

-15% su kodu: ENG15
48,81 
Įprasta kaina: 57,42 
-15% su kodu: ENG15
Kupono kodas: ENG15
Akcija baigiasi: 2025-03-03
-15% su kodu: ENG15
48,81 
Įprasta kaina: 57,42 
-15% su kodu: ENG15
Kupono kodas: ENG15
Akcija baigiasi: 2025-03-03
-15% su kodu: ENG15
2025-02-28 57.4200 InStock
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Knygos aprašymas

Developing higher density microelectronics devices is the impact of the stresses induced by Coefficient of Thermal Expansion (CTE) mismatches of the materials used. Here I discuss the use of 3D grain continuum modeling to study grain boundary migration driven by differences in strain energy density. Comsol Multiphysics 4.3a (CM) is being used to compute stresses and strain energy densities in polycrystalline structures caused by temperature changes. We treat each grain as a single crystal, with the anisotropic elastic properties of single crystal Cu appropriately rotated to match grain orientation in space.

Informacija

Autorius: Manvinder Sharma, Dishant Khosla, Sohni Singh,
Leidėjas: LAP LAMBERT Academic Publishing
Išleidimo metai: 2018
Knygos puslapių skaičius: 68
ISBN-10: 6139877873
ISBN-13: 9786139877874
Formatas: 220 x 150 x 5 mm. Knyga minkštu viršeliu
Kalba: Anglų

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