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Force Sensors for Microelectronic Packaging Applications

-15% su kodu: ENG15
143,97 
Įprasta kaina: 169,38 
-15% su kodu: ENG15
Kupono kodas: ENG15
Akcija baigiasi: 2025-03-03
-15% su kodu: ENG15
143,97 
Įprasta kaina: 169,38 
-15% su kodu: ENG15
Kupono kodas: ENG15
Akcija baigiasi: 2025-03-03
-15% su kodu: ENG15
2025-02-28 169.3800 InStock
Nemokamas pristatymas į paštomatus per 11-15 darbo dienų užsakymams nuo 20,00 

Knygos aprašymas

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

Informacija

Autorius: Jürg Schwizer, Oliver Brand, Michael Mayer,
Serija: Microtechnology and MEMS
Leidėjas: Springer Berlin Heidelberg
Išleidimo metai: 2010
Knygos puslapių skaičius: 188
ISBN-10: 3642060633
ISBN-13: 9783642060632
Formatas: 235 x 155 x 11 mm. Knyga minkštu viršeliu
Kalba: Anglų

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