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With the increasing availability of MMICs at high frequencies beyond 100 GHz low-loss interconnects for module fabrication become essential. This work presents the results of the flip-chip interconnects approach exhibiting bandwidths from 220 GHz up to 500 GHz. Flip-chip transitions in this study were fabricated based on simulated 3D models in three different topologies: coplanar-to-coplanar, stripline-to-coplanar, and stripline-to-stripline. The interconnects were realized with 10 µm-diameter AuSn microbumps. After the flip-chip mounting, scattering parameter measurements were performed to characterize the interconnect quality. The results suggest that the flip-chip technology is currently the most suitable technology for the high frequency range.
| Autorius: | Sirinpa Monayakul |
| Serija: | Innovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz |
| Leidėjas: | Cuvillier |
| Išleidimo metai: | 2016 |
| Knygos puslapių skaičius: | 148 |
| ISBN-10: | 3736994109 |
| ISBN-13: | 9783736994102 |
| Formatas: | 210 x 148 x 8 mm. Knyga minkštu viršeliu |
| Kalba: | Anglų |
Parašykite atsiliepimą apie „Development of Sub-mm Wave Flip-Chip Interconnect“
