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This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
| Autorius: | Krishnendu Chakrabarty, Brandon Noia, |
| Leidėjas: | Springer International Publishing |
| Išleidimo metai: | 2013 |
| Knygos puslapių skaičius: | 264 |
| ISBN-10: | 3319023772 |
| ISBN-13: | 9783319023779 |
| Formatas: | 241 x 160 x 20 mm. Knyga kietu viršeliu |
| Kalba: | Anglų |
Parašykite atsiliepimą apie „Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs“
