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This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
| Autorius: | Ning-Cheng Lee, John H. Lau, |
| Leidėjas: | Springer Nature Singapore |
| Išleidimo metai: | 2020 |
| Knygos puslapių skaičius: | 552 |
| ISBN-10: | 9811539197 |
| ISBN-13: | 9789811539190 |
| Formatas: | 241 x 160 x 34 mm. Knyga kietu viršeliu |
| Kalba: | Anglų |
Parašykite atsiliepimą apie „Assembly and Reliability of Lead-Free Solder Joints“
