This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
| Autorius: | Khaled Salah, Alaa El-Rouby, Yehea Ismail, |
| Serija: | Analog Circuits and Signal Processing |
| Leidėjas: | Springer Nature Switzerland |
| Išleidimo metai: | 2016 |
| Knygos puslapių skaičius: | 192 |
| ISBN-10: | 3319374974 |
| ISBN-13: | 9783319374970 |
| Formatas: | 235 x 155 x 11 mm. Knyga minkštu viršeliu |
| Kalba: | Anglų |
Parašykite atsiliepimą apie „Arbitrary Modeling of TSVs for 3D Integrated Circuits“
