David A. Dornfeld

Rasta: 3
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales
-15% su kodu: ENG15
215,97 
254,08 
Išsiųsime per 11-15 d. d.
Precision Manufacturing
-15% su kodu: ENG15
Knyga minkštu viršeliu
(0)
154,26 
181,48 
Išsiųsime per 11-15 d. d.
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales
-15% su kodu: ENG15
215,97 
254,08 
Išsiųsime per 11-15 d. d.
Rasta: 3